Although processors are the stars of the show in computer design, without their supporting circuitry they're only printed sand. And as processor design advances in speed, complexity and capability, the chipsets that surround them must change to support those capabilities with new and faster features.
Intel's latest motherboard chipsets, previously codenamed Alderwood and Grantsdale, are aimed at high-performance motherboards and designed to work primarily with new and repackaged Pentium 4s ranging from the Pentium 4 520 at 2.8GHz to the P4 560 at 3.6GHz. All come with 1MB of Level 2 (L2) cache and an 800MHz frontside bus; there's also a repackaged Extreme Edition part. All are housed in a new Leadless Grid Array LGA775 package. This presents the chip's connections as a grid of conductors flush with the bottom of the case -- a technique previously used on the Pentium II core.
Intel's new LGA775 package presents the Pentium 4's connections as a grid of conductors flush with the bottom of the case.
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